Metal Finishing Guide Book

2011-2012 Surface Finishing Guidebook

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as discussed above, the distribution width dropped to +/- 3%. For silver, the results were similar. The shorted rack had a distribution of +/- 7.8%. The constant current rack dropped the distribution width to =/- 5% and the individually con- trolled rack had a distribution width of +/- 3.3%. REFERENCES 1. Submitted to U.S. Patent Office 1 2. Semiconductor International, Oct. 1, 2007 ABOUT THE AUTHORS Thomas Beckett is a metal finishing specialist and plating consultant for CMC Laboratories, a technology solutions company that provides analytical and labscale plating services, pro- gram management, and marketing research for clients focusing on advanced materials and all levels of electronic interconnection. Thomas (Tom) Beckett has been working in the metal finishing industry for more than 30 years. Beckett has extensive experience with electrochemical and finishing processes such as cleaning, phosphating, organic finishing, and base metal plating, including nickel-chrome, precious metals, electroless nickels and gold plating. Beckett has expertise in laboratory procedures, wet analysis, and analytical instrumentation. Beckett has also designed and installed plating equipment for PWB's, nickel-gold tab lines and other specialty installations. Beckett's professional record includes metal finishing engineering at CMC Wireless Components and Nelco, Inc., where he focused on solving existing issues to improve man- ufacturing processes, productivity and yield. Tom currently provides professional plating engi- neering assistance through his company, Tom Beckett Electrochemical Consulting. Beckett received his BS in Bio-Chemistry from Chicago State University in Chicago, Illinois, with a minor in Physical Science and Mathematics. Gabe Carrasco is a senior test engineer. Drawing from more than 10 years experience in testing ceramic packaging, Carrasco has the knowledge, experience, and judgment needed to apply measurements in the most effective manner. He held key technical and management positions while serving with Carborundum and CMC Wireless Components, starting with senior Q/A technician and advancing to test engineer, manufacturing manager, and then vice president of operations. For CMC Laboratories, Carrasco serves as the Sr. Test Engineer overseeing the Environmental, Thermal and RF/Electrical testing. Dr. J. Harris has played a leadership role in the advanced ceramic materials and electronic packaging industry over the past 20 years. Dr. Harris is currently the President of CMC Laboratories, Inc., a materials analysis and consulting firm that focuses on advanced mate- rials used in electronic applications. CMC provides a range of technology services, including materials related consulting, materials characterization, analytical services, prototype fab- rication, and technology licensing. Dr. Harris received his doctorate in Solid State Physics from Brown University (Providence, RI) in 1983. He is the author of more than 50 publications and book chapters and has 20 US Patents. Erich Rubel is director, analytical services. He has more than 20 years of experience work- ing in quality, R&D;, and failure analysis laboratories serving both the electronics and aerospace industry. His educational and technical focus spans the fields of chemistry, met- allurgy, and materials science. Rubel gained extensive familiarity with advanced materials and processes while working at Honeywell, Inc. and later at CMC Wireless Components. He currently manages the SEM and Metallurgical Laboratories at CMC Laboratories. 142

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