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NOTES 1. Modern Electroplating. 4th ed. Schlesinger, M., Paunovic, M., eds. John Wiley & Sons, Inc., 2000. 2. Dini, J.W. Electrodeposition. Park Ridge, NJ: Noyes Publication, 1993. 3. Gold Plating Technology. Goldie, W., Reid, F.H., eds. Ayr, Scotland: Electrochemical Publications, 1974. 4. Electroless Plating: Fundamentals and Applications. Haydu, J. B., Mallory, G.O., eds. American Electroplaters and Surface Finishers Society, 1990. 5. Brenner, A. Electrodeposition of Alloys. Vols. I & II. New York, NY: Academic Press, 1963. 6. Electroplating Engineering Handbook. 4th ed. Durney, L.J., ed. New York, NY: Chapman & Hall, 1984. 7. Jordan, M. The Electrodeposition of Tin and its Alloys. Saulgau/Wurtt, Germany: Eugen G. Leuze, 1995. 8. Langford, K.E., Parker, J.E. Analysis of Electroplating and Related Solutions. Teddington, UK: Robert Draper Ltd.,1971. 9. Irvine, T.H. Chemical Analysis of Electroplating Solutions. New York, NY: Chemical Publishing Co., 1970. 10. Standard Methods for Examination of Water and Waste Water. 18th ed. Washington, DC: American Public Health Association, 1992. 11. American Society for Testing Materials. Standard practice for the use of copper and nickel electroplating solutions for electroforming. In: Annual Book of ASTM Standards. Philadelphia, PA: ASTM, 1993:B503–69. 12. Metal Finishing Guidebook and Directory. New York, NY: Elsevier, 2008. 13. Instruments based on this technique are marketed by ECI Technology and Technic, Inc. for automatic analysis of acid copper bath. Metrohm offers auto-titrators for potentiometric determination of copper, sulfuric acid, and chloride and estimation of brighteners using cyclic voltammetry. 460