Metal Finishing Guide Book


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any commercial products mentioned in this paper. Plating shops should evaluate baths, analytical techniques, and ancillary procedures for best results in their operations. NOTES 1. Modern Electroplating. 4th ed. Schlesinger, M., Paunovic, M., eds. John Wiley & Sons, Inc., 2000. 2. Dini, J.W. Electrodeposition. Park Ridge, NJ: Noyes Publication, 1993. 3. Gold Plating Technology. Goldie, W., Reid, F.H., eds. Ayr, Scotland: Electrochemical Publications, 1974. 4. Electroless Plating: Fundamentals and Applications. Haydu, J. B., Mallory, G.O., eds. American Electroplaters and Surface Finishers Society, 1990. 5. Brenner, A. Electrodeposition of Alloys. Vols. I & II. New York, NY: Academic Press, 1963. 6. Electroplating Engineering Handbook. 4th ed. Durney, L.J., ed. New York, NY: Chapman & Hall, 1984. 7. Jordan, M. The Electrodeposition of Tin and its Alloys. Saulgau/Wurtt, Germany: Eugen G. Leuze, 1995. 8. Langford, K.E., Parker, J.E. Analysis of Electroplating and Related Solutions. Teddington, UK: Robert Draper Ltd.,1971. 9. Irvine, T.H. Chemical Analysis of Electroplating Solutions. New York, NY: Chemical Publishing Co., 1970. 10. Standard Methods for Examination of Water and Waste Water. 18th ed. Washington, DC: American Public Health Association, 1992. 11. American Society for Testing Materials. Standard practice for the use of copper and nickel electroplating solutions for electroforming. In: Annual Book of ASTM Standards. Philadelphia, PA: ASTM, 1993:B503–69. 12. Metal Finishing Guidebook and Directory. New York, NY: Elsevier, 2008. 13. Instruments based on this technique are marketed by ECI Technology and Technic, Inc. for automatic analysis of acid copper bath. Metrohm offers auto-titrators for potentiometric determination of copper, sulfuric acid, and chloride and estimation of brighteners using cyclic voltammetry. 470

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