Metal Finishing Guide Book

2011-2012 Surface Finishing Guidebook

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Page 351 of 707

Group II Plating Solutions For Alloys *Metal Matrix Deposit Brass Babbitt Navy Grade 2 Bronze *Cobalt Chromium Carbide Cobalt-Tungsten Nickel-Cobalt Nickel Phosphorous Group III Special Purpose Solutions and Gels* Anodizing (chromic*) Anodizing (sulfuric) Anodizing (hard coat) Anodizing (phosphoric*) Anodizing (boric-sulfuric*) Trivalent Chromium Conversion Electropolishing Cadmium Alternatives Black Optical The chart contains all of the information (solutions and sequence of use, voltages, polarities, estimated plating amperage, ampere-hours, times, etc.) necessary to per- form the process operations properly and without hesitation. CONCLUSION While the process known as selective, brush plating was emphasized in this article, other portable processes such as selective anodizing and selective elec- tropolishing are widely used in industry as well. Selective plating is a viable alternative to tank plating and to other processes such as thermal sprays when deposit thicknesses of less than 0.035" are required. It is a process that lets you apply a wide range of localized deposits and coatings either in the shop or out in the field with very accurate thickness control. Selective plating is a flexible and reliable process for OEM and repair applications. Nickel-Tungsten Tin-Antimony Tin-Zinc Tin-Indium Tin-Lead-Nickel Zinc-Nickel (LHE) 350

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