Metal Finishing Guide Book

2011-2012 Surface Finishing Guidebook

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closely reproduce the types of con- tours and areas generally found on production parts in the plating tank. The bottom of the panel is useful for representing the lower portion of parts in the plating tank. Typical problems include pitting or air pat- tern haziness on the bottom of the panels. Figure 1: Jiggle cell panels (Images courtesy of Finishing Test Supply). The two faces are good for repre- senting the vertical areas of parts in the plating tanks. The recessed area mimics a typical recess on plating tank parts. It also represents the shelf or top of parts in a plating tank. JIGGLE CELLS Figure 2: Air- and mechanically agitated jiggle cell. Jiggle cells are usually supplied in various configurations: Air or mechanical agitation with heat and temperature control: This type of unit will allow the operator to check both air and mechanically agitated plating baths. The heating controls allow the operator to also check heat- ed and unheated plating solutions. The motor on the right will move the cathode up and down, providing the mechanical agitation (Fig. 2). Air agitation with heat and temperature control: This unit will do air-agitated solu- tions but not mechanically agitated solutions. The unit does not have a motor to move the cathode panel up and down. See the example in Figure 3. JIGGLE CELL ANODES Jiggle cell anodes are usually 1 inch wide × 7 inches or longer. The anode mate- rial will usually match the anode material used in the plating bath to be tested. The anode should be bagged to prevent anode fines or sludge from entering the solution. Figure 4 shows examples of various jiggle cell anodes. Test Procedure The test procedure should be standardized to allow for reproducibility between tests. All steps should be taken to ensure that the conditions in the jiggle cell close- ly match the conditions in the plating tank. Particular attention should be paid to the agitation, current density, and temperature. The finishing test equipment supplier will usually provide the user with rec- ommended tips for the various plating tests. The cathode will need to be carefully prepared for each test with a standard- ized procedure. Care should be taken to ensure that the cathode panel is not con- taminated from fingerprints or handling marks, poor cleaning, or poor activa- 464

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