Metal Finishing Guide Book


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Page 452 of 903

Group II Plating Solutions For Alloys *Metal Matrix Deposit Brass Nickel-Tungsten Babbitt Navy Grade 2 Tin-Antimony Bronze Tin-Zinc *Cobalt Chromium Carbide Tin-Indium Cobalt-Tungsten Tin-Lead-Nickel Nickel-Cobalt Zinc-Nickel (LHE) Nickel Phosphorous Group III Special Purpose Solutions and Gels* Anodizing (chromic*) Trivalent Chromium Conversion Anodizing (sulfuric) Electropolishing Anodizing (hard coat) Cadmium Alternatives Anodizing (phosphoric*) Black Optical Anodizing (boric-sulfuric*) The chart contains all of the information (solutions and sequence of use, voltages, polarities, estimated plating amperage, ampere-hours, times, etc.) necessary to perform the process operations properly and without hesitation. CONCLUSION While the process known as selective, brush plating was emphasized in this article, other portable processes such as selective anodizing and selective electropolishing are widely used in industry as well. Selective plating is a viable alternative to tank plating and to other processes such as thermal sprays when deposit thicknesses of less than 0.035��� are required. It is a process that lets you apply a wide range of localized deposits and coatings either in the shop or out in the field with very accurate thickness control. Selective plating is a flexible and reliable process for OEM and repair applications. 445

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