Metal Finishing Guide Book

2012-2013

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Problem Possible Cause How to Correct Cloudy deposit MCD or HCD 1. Low leveler 2. Low pH 3. High control agent 4. High STEP Additive 5. Organic contamination 6. Metallic contamination (e.g., Fe, Si, Al, Cr+3) 7. Low agitation 1. Increase concentration of leveler 2. Adjust pH upward 3. Reduce control agent concentration (carbon filter) 4. Temporarily discontinue additions 5. Carbon treatment 6. High pH + carbon treatment 7. Increase agitation Cloudy deposit LCD Area 1. Low leveler 2. Low pH 1. Adjust leveler concentration 2. Adjust pH Dull deposit LCD Area 1. Metallic contamination 1. "Dummy" solution at 4���5 ASF Poor leveling 1. Low leveler 2. Low control agent 3. Low pH 4. High STEP additive 5. Low agitation 1. Add leveler 2. Add control agent 3. Adjust pH 4. Temporarily discontinue additions 5. Adjust agitation Poor ductility 1. High Leveler 2. Low control agent 3. High pH 4. Metallic contamination (e.g., Zn, Pb, Cd) 5. Organic contamination 1. Reduce leveler concentration 2. Add control agent 3. Adjust pH 4. "Dummy" solution at 4���5 ASF 5. Carbon treatment Burning 1. Low nickel salts/boric acid 2. High CD 3. Low temperature 4. Low agitation 5. Chromate contamination 6. Metallic contamination 1. Add nickel salts/boric acid 2. Reduce CD 3. Adjust temperature 4. Increase agitation rate 5. High CD "dummy" + high pH treatment* 6. High pH + carbon treatment Skip plating 1. High leveler 2. Low control agent 3. Metallic contamination (e.g., Pb, Zn, Cd, Cr+6) 1. "Dummy" solution at 4���5 ASF 2. Add control agent 3. "Dummy" solution at 4���5 ASF Semibright Nickel���Non-Coumarin: Panels are usually plated at 2 amps for 5 minutes on steel panels. 530

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